System for providing dynamic feedback for selective adhesion pcb production

ABSTRACT

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

RELATED APPLICATION

The current patent application is a divisional patent application whichclaims priority benefit, with regard to all common subject matter, ofearlier-filed U.S. patent application Ser. No. 16/816,607, titled“SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCBPRODUCTION”, filed Mar. 12, 2020. The earlier-filed patent applicationis hereby incorporated by reference, in its entirety, into the currentpatent application.

STATEMENT REGARDING FEDERALLY-SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with Government support under Contract No.:DE-NA0000622 awarded by the United States Department of Energy/NationalNuclear Security Administration. The Government has certain rights inthe invention.

FIELD OF THE INVENTION

Embodiments of the current invention relate to systems for providingdynamic feedback for selective adhesion printed circuit board (PCB)production.

DESCRIPTION OF THE RELATED ART

Printed circuit boards (PCBs) are typically produced in a multi-stepprocess that involves mask exposure and board etching and requires thata design of the PCB, i.e., a pattern of traces and pads that form theprinted circuit, be fixed from the start of the process to the end ofthe process. Making any corrections or changes to the design of the PCBrequires major changes to the production process. The changes may resultin a long lead time and increased costs for production to continue.

SUMMARY OF THE INVENTION

Embodiments of the current invention solve the above-mentioned problemsand provide systems that allow for multiple PCB designs to be producedwithout any delay between the production of different designs. Oneembodiment of the system broadly comprises a conveyor mechanism, acuring system, and a computer. The conveyor mechanism is configured toconvey a series of selective adhesion blanks, wherein each selectiveadhesion blank is utilized to produce a PCB and includes a flexiblefilm, a substrate, a conductive layer, and a curable adhesive. Theflexible film forms a top layer of the selective adhesion blank. Thesubstrate forms a bottom layer of the selective adhesion blank. Theconductive layer is formed from electrically conductive material and isadhered to the substrate. The curable adhesive is positioned between theflexible film and the conductive layer and is configured to selectivelybond with the conductive layer when the curable adhesive is cured. Thecuring system is configured to cure the curable adhesive for eachselective adhesion blank. The computer includes a processing element inelectronic communication with a memory element. The processing elementis configured or programmed to: receive a plurality of PCB designs, anddirect the curing system to cure the curable adhesive of a plurality ofselective adhesion blanks for each PCB design.

Another embodiment of the system allows for changes to the design of thePCB to be made based on optical inspection of selective adhesion blanksthat are prepopulated with parts. The system broadly comprises aconveyor mechanism, an optical inspection unit, a curing system, and acomputer. The conveyor mechanism is configured to convey a series ofselective adhesion blanks, wherein each selective adhesion blank isprepopulated with parts and utilized to produce a PCB. Each selectiveadhesion blank includes a flexible film, a substrate, a conductivelayer, and a curable adhesive. The flexible film forms a top layer ofthe selective adhesion blank. The substrate forms a bottom layer of theselective adhesion blank. The conductive layer is formed fromelectrically conductive material and is adhered to the substrate. Thecurable adhesive is positioned between the flexible film and theconductive layer and is configured to selectively bond with theconductive layer when the curable adhesive is cured. The opticalinspection unit is configured to generate current image data of eachselective adhesion blank. The curing system is configured to cure thecurable adhesive for each selective adhesion blank. The computerincludes a processing element in electronic communication with a memoryelement. The processing element is configured or programmed to: receivea PCB design including placement of the parts and a pattern of tracesand pads, receive the current image data, compare the current image datawith standard image data corresponding to the PCB design, determine amodification to the PCB design if a difference between the current imagedata and the standard image data is detected, and direct the curingsystem to cure the curable adhesive of each selective adhesion blank forwhich the difference is detected according to the modification of thePCB design.

Yet another embodiment of the system broadly comprises a conveyormechanism, an optical inspection unit, a curing system, a peel roller,and a computer. The conveyor mechanism is configured to convey a seriesof selective adhesion blanks, wherein each selective adhesion blank isprepopulated with parts and utilized to produce a PCB. Each selectiveadhesion blank includes a flexible film, a substrate, a conductivelayer, and a curable adhesive. The flexible film forms a top layer ofthe selective adhesion blank. The substrate forms a bottom layer of theselective adhesion blank. The conductive layer is formed fromelectrically conductive material and is adhered to the substrate. Thecurable adhesive is positioned between the flexible film and theconductive layer and is configured to selectively bond with theconductive layer when the curable adhesive is cured. The opticalinspection unit is configured to generate current image data of eachselective adhesion blank. The curing system is configured to cure thecurable adhesive for each selective adhesion blank. The peel roller isconfigured to remove the flexible film, the curable adhesive, and thebonded conductive layer. The computer includes a processing element inelectronic communication with a memory element. The processing elementis configured or programmed to: receive a PCB design including placementof the parts and a pattern of traces and pads, receive the current imagedata, compare the current image data with standard image datacorresponding to the PCB design, determine a modification to the PCBdesign if a difference between the current image data and the standardimage data is detected, direct the curing system to cure the curableadhesive of each selective adhesion blank for which the difference isdetected according to the modification of the PCB design, and direct thecuring system to cure the curable adhesive of each selective adhesionblank according to the PCB design if a difference between the currentimage data and the standard image data is not detected.

This summary is provided to introduce a selection of concepts in asimplified form that are further described below in the detaileddescription. This summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter. Other aspectsand advantages of the current invention will be apparent from thefollowing detailed description of the embodiments and the accompanyingdrawing figures.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

Embodiments of the current invention are described in detail below withreference to the attached drawing figures, wherein:

FIG. 1 is a schematic block diagram of a system, constructed inaccordance with various embodiments of the current invention, forproviding selective adhesion printed circuit board (PCB) production, thesystem including a conveyor mechanism, a curing system, a peel roller,and a computer;

FIG. 2 is a side cross-sectional view of a prior art selective adhesionblank including a flexible film, a curable adhesive, a conductive layer,and a substrate, oriented from top to bottom in a stack;

FIG. 3 is a side cross-sectional view of the selective adhesion blankillustrating the flexible film, the curable adhesive, and a selectiveportion of the conductive layer being lifted;

FIG. 4 is a schematic block diagram of three embodiments of the curingsystem;

FIG. 5 is a top view of the conveyor mechanism conveying a plurality ofselective adhesion blanks during first and second time periods of theproduction process;

FIG. 6 is a schematic block diagram of a system, constructed inaccordance with other embodiments of the current invention, forproviding dynamic feedback for selective adhesion printed circuit board(PCB) production;

FIG. 7 is a perspective view of a first set of examples of variousmodifications to a PCB design performed by the system of FIG. 6 ; and

FIG. 8 is a perspective view of a second set of examples of variousmodifications to a PCB design performed by the system of FIG. 6 .

The drawing figures do not limit the current invention to the specificembodiments disclosed and described herein. The drawings are notnecessarily to scale, emphasis instead being placed upon clearlyillustrating the principles of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The following detailed description of the technology references theaccompanying drawings that illustrate specific embodiments in which thetechnology can be practiced. The embodiments are intended to describeaspects of the technology in sufficient detail to enable those skilledin the art to practice the technology. Other embodiments can be utilizedand changes can be made without departing from the scope of the currentinvention. The following detailed description is, therefore, not to betaken in a limiting sense. The scope of the current invention is definedonly by the appended claims, along with the full scope of equivalents towhich such claims are entitled.

Referring to FIGS. 1, 4, and 5 , a system 10 for providing selectiveadhesion printed circuit board (PCB) production is shown. The system 10is configured to be best implemented with a selective adhesion blank 12,which is utilized in a process to produce a PCB 14, as described in U.S.Pat. No. 9,504,148, “RAPID PCB PROTOTYPING BY SELECTIVE ADHESION”,issued Nov. 22, 2016, and U.S. patent application Ser. No. 16/253,296,“SYSTEM AND METHOD FOR LARGE-SCALE PCB PRODUCTION INCLUDING CONTINUOUSSELECTIVE ADHESION”, filed Jan. 22, 2019, each of which is herebyincorporated by reference, in its entirety, into the current patentapplication.

The selective adhesion blank 12 and its use in fabricating a PCB 14 issummarized as follows. The selective adhesion blank 12 includes onelayer each of the following materials oriented in a stack from top tobottom in the listed order: a flexible film 16, a curable adhesive 18, aconductive layer 20, and a substrate 22. The flexible film 16 may beformed from flexible plastic, polyester, or any other suitable flexiblematerial and is generally transmissive, transparent, or translucent to abroad range of wavelengths of radiation including near-UV light, UVlight, blue wavelength light, and others. In addition, the flexible film16 may be easily sheared, torn, or cut. The curable adhesive 18generally cures, hardens, or bonds when exposed to near-UV light, UVlight, blue wavelength light, or other stimulation such as infraredradiation or heat, but otherwise remains pliable and separable. Theconductive layer 20 is formed from electrically conductive materials,such as metals or metal alloys, and may be provided as a layer of foilor may be applied by spraying, vapor deposition, or other methods. Inaddition, the conductive layer 20 may be easily sheared, torn, or cut.The substrate 22 may be formed from fiberglass, polymers, resins, or thelike, or combinations thereof, and may be rigid or flexible. Theflexible film 16 is firmly bonded to the curable adhesive 18. Thecurable adhesive 18 is lightly adhered to the conductive layer 20, butmore firmly bonds to the conductive layer 20 when the curable adhesive18 is cured. The conductive layer 20 is adhered to the substrate 22, butonce the curable adhesive 18 is cured, the bond between the curableadhesive 18 and the conductive layer 20 is greater than the bond betweenthe conductive layer 20 and the substrate 22.

The PCB 14 may be formed from the selective adhesion blank 12 asfollows. Referring to FIGS. 2 and 3 , the selective adhesion blank 12 ispositioned to have the flexible film 16 and the curable adhesive 18exposed to a radiation source generating radiation 24. In someembodiments, the radiation source may be a laser which can beprogrammed, controlled, and directed to expose selected areas orportions of the curable adhesive 18 in order to create a proper patternof traces and pads to form the desired printed circuit. As shown in FIG.2 , the radiation 24 has been directed to strike three separate areas ofthe flexible film 16 and the curable adhesive 18. In other embodiments,the radiation source may include one or more radiation generators whichgenerate radiation 24 to cover the entire surfaces of the flexible film16 and curable adhesive 18 during an exposure. In order to create thepattern of traces and pads, one or more masks may be used, such that themasks shield the curable adhesive from the radiation 24 in those areaswhere traces and pads are desired. The masks may be separate films orplates that are placed on the surface of the flexible film 16. Or, themasks may be printed onto the surface of the flexible film 16.

In those areas exposed to the radiation 24, the curable adhesive 18cures and firmly bonds to the conductive layer 20. The flexible film 16is then removed from the selective adhesion blank 12 by applying apulling force, as shown in FIG. 3 . In those areas where the conductivelayer 20 is bonded to the curable adhesive 18, those areas of theconductive layer 20 tear and separate from the areas not bonded to thecurable adhesive 18. The remaining conductive layer 20 forms the patternof traces and pads which is the printed circuit. Once the flexible film16 and the conductive layer 20 bonded thereto are removed, then theremaining conductive layer 20 and the substrate 22 form the PCB 14.

The system 10 of the current invention broadly comprises a conveyormechanism 26, a peel roller 28, a curing system 30, and a computer 32.The conveyor mechanism 26 includes a belt 34 and first and secondrollers 36A, 36B. The belt 34 is formed from a closed loop of flexiblematerial, such as rubbers, polymers, or the like, or combinationsthereof. The first and second rollers 36A, 36B are spaced apart from oneanother. The belt 34 is wrapped around each roller 36A, 36B, so thatwhen the rollers 36A, 36B rotate, the conveyor mechanism 26 moves orconveys selective adhesion blanks 12 and PCBs 10.

The peel roller 28 includes a circumferential side wall. In someembodiments, the side wall may include a tacky or sticky outer surface.In other embodiments, the side wall may include a plurality of ports oropenings distributed along its circumference through which vacuum orsuction may be applied. In yet other embodiments, the side wall mayinclude one or more mating or interlocking features on the outer surfacethat engage with complementary features on the selective adhesion blank12. The peel roller 28 contacts the upper surface of the flexible film16 of the selective adhesion blank 12 in order to remove the flexiblefilm 16, the curable adhesive 18, and the bonded conductive layer 20.

The curing system 30 generally provides the radiation 24 to cure thecurable adhesive 18 of the selective adhesion blank 12. In someembodiments, the curing system 30 includes a laser source 38 configuredto generate the radiation 24 in the form of a laser beam having awavelength in the near-UV light, UV light, or blue wavelength lightranges to cure the curable adhesive 18. The laser beam may be controlledand directed to strike the surfaces of the flexible film 16 and thecurable adhesive 18, perhaps in a scanning fashion, in a pattern thatforms the traces and pads of the printed circuit. In other embodiments,the curing system 30 may include one or more radiation generators whichgenerate radiation 24 to cover the entire surfaces of the flexible film16 and curable adhesive 18 during an exposure. At least one mask thatincludes a negative of the pattern of traces and pads of the printedcircuit is used during the exposure. The curing system 30 may include aplacement mechanism 40 that is configured to place the mask on the uppersurface of the flexible film 16. In still other embodiments, the curingsystem 30 may include the one or more radiation generators to generateradiation 24 as well as a printing mechanism 42 to print the negativepattern mask onto the upper surface of the flexible film 16. In variousembodiments, the curing system 30 may include controlling and/orprocessing electronic circuitry and memory or data storage whichcontrols the operation of the components utilized in each embodimentmentioned above.

The computer 32 generally provides control of the conveyor mechanism 26and the curing system 30 and includes a memory element 44 and aprocessing element 46. The computer 32 may be embodied by workstationcomputers, desktop computers, laptop computers, palmtop computers,notebook computers, tablets or tablet computers, or the like. Thecomputer 32 may also include a display, a user interface, one or morecommunication elements, and the like which are not discussed in detail.

The memory element 44 may be embodied by devices or components thatstore data in general, and digital or binary data in particular, and mayinclude exemplary electronic hardware data storage devices or componentssuch as read-only memory (ROM), programmable ROM, erasable programmableROM, random-access memory (RAM) such as static RAM (SRAM) or dynamic RAM(DRAM), cache memory, hard disks, floppy disks, optical disks, flashmemory, thumb drives, universal serial bus (USB) drives, or the like, orcombinations thereof. In some embodiments, the memory element 44 may beembedded in, or packaged in the same package as, the processing element46. The memory element 44 may include, or may constitute, anon-transitory “computer-readable medium”. The memory element 44 maystore the instructions, code, code statements, code segments, software,firmware, programs, applications, apps, services, daemons, or the likethat are executed by the processing element 46. The memory element 44may also store data that is received by the processing element 46 or thedevice in which the processing element 46 is implemented. The processingelement 46 may further store data or intermediate results generatedduring processing, calculations, and/or computations as well as data orfinal results after processing, calculations, and/or computations. Inaddition, the memory element 44 may store settings, data, documents,sound files, photographs, movies, images, databases, and the like.

The processing element 46 may comprise one or more processors. Theprocessing element 46 may include electronic hardware components such asmicroprocessors (single-core or multi-core), microcontrollers, digitalsignal processors (DSPs), field-programmable gate arrays (FPGAs), analogand/or digital application-specific integrated circuits (ASICs), or thelike, or combinations thereof. The processing element 46 may generallyexecute, process, or run instructions, code, code segments, codestatements, software, firmware, programs, applications, apps, processes,services, daemons, or the like. The processing element 46 may alsoinclude hardware components such as registers, finite-state machines,sequential and combinational logic, and other electronic circuits thatcan perform the functions necessary for the operation of the currentinvention. In certain embodiments, the processing element 46 may includemultiple computational components and functional blocks that arepackaged separately but function as a single unit. The processingelement 46 may be in electronic communication with the other electroniccomponents through serial or parallel links that include universalbusses, address busses, data busses, control lines, and the like.

The computer 32 in general, and processing element 46 specifically, maybe operable, configured, or programmed to perform the followingfunctions by utilizing hardware, software, firmware, or combinationsthereof. The computer 32 receives a plurality of designs, wherein eachdesign includes the pattern to form the traces and pads for a printedcircuit. Typically, there is one design per PCB 14. In some instances,more than one design may be implemented on a single PCB 14, wherein thePCB 14 may be cut into separate PCBs 10, one PCB 14 per design, later inthe production process. Furthermore, each design may be utilized toproduce a plurality of PCBs 10. For example, a first design may beutilized to produce 100 PCBs 10, each including a first printed circuit.A second design may be utilized to produce 500 PCBs 10, each including asecond printed circuit—and so forth with additional designs to produceadditional PCBs 10. Thus, the computer 32 may establish a sequence ofdesigns to be implemented.

The computer 32 controls or directs the curing system 30 to apply theappropriate curing scheme for each design. For example, in someembodiments, the computer 32 may determine a set of instructions or aprogram to control the laser source 38 to direct the laser beam in theappropriate path to create the pattern of traces and pads for eachdesign. Alternatively, the computer 32 may retrieve the instruction setor program from the memory element 44 according to the design.Otherwise, the curing system 30 may include a plurality of instructionsets or programs, one for each design, stored in its memory. Thecomputer 32 may direct the curing system 30 on which instruction set orprogram to use for each design. The computer 32 may transmit one or moresignals, a stream of data, or a combination thereof to the curing system30 for each PCB 14 to be produced or for each design to be implementedon a plurality of PCBs 10.

In other embodiments, the computer 32 may determine the timing for whento energize the radiation source (that does not include a laser) of thecuring system 30. In addition, the computer 32 may control or direct theplacement mechanism 40 to position the mask over the flexible film 16and the curable adhesive 18. The curing system 30 may include at leastone mask for each design. The computer 32 may control or direct theplacement mechanism 40 to position the appropriate mask for each design.Alternatively, the computer 32 may control or direct the printingmechanism 42 to print the appropriate mask on the flexible film 16 foreach design.

In various embodiments, the computer 32 may also control or direct theoperation of the conveyor mechanism 26 and the peel roller 28. Forexample, the computer 32 may control the direction of motion and thespeed of the belt 34 of the conveyor mechanism 26. The computer 32 mayset a constant speed for the belt 34 or may reduce the speed of the belt34 while each selective adhesion blank 12 is being cured. Likewise, thecomputer 32 may control the speed and direction of rotation of the peelroller 28. The computer 32 may set a constant speed of rotation for thepeel roller 28 or reduce the speed of rotation while each selectiveadhesion blank 12 is being cured, such that the speed of rotation of thepeel roller 28 corresponds to the speed of motion of the conveyormechanism 26. The computer 32 may transmit one or more signals, a streamof data, or a combination thereof to the conveyor mechanism 26 and thepeel roller 28.

The system 10 may operate as follows. A series of selective adhesionblanks 12 are fed or supplied to the conveyor mechanism 26. Theselective adhesion blanks 12 move forward on the conveyor mechanism 26to the curing system 30. The computer 32 may direct or control theoperation of the conveyor mechanism 26, such as setting the speed, andstarting and stopping the belt 34. The curing system 30 cures thecurable adhesive 18 according to the design for the PCB 14 to beproduced. If using a laser source 38, the curing system 30 may scan theselective adhesion blank 12 from one end to the opposite end. Afterbeing cured, the selective adhesion blanks 12 move forward on theconveyor mechanism 26 to the peel roller 28. The side wall of the peelroller 28 contacts the upper surface of the flexible film 16 andattaches to the flexible film 16. As the conveyor mechanism 26 moves theselective adhesion blank 12 forward, the rotation of the peel roller 28pulls the flexible film 16 upward, removing the flexible film 16, thecurable adhesive 18, and the bonded conductive layer 20. After theselective adhesion blank 12 moves past the peel roller 28, the flexiblefilm 16, the curable adhesive 18, and the bonded conductive layer 20 arecompletely removed, and the PCB 14 is ready to be further processed.

The system 10 is also configured to automatically produce a plurality ofPCB designs, wherein each design is used to produce a plurality of PCBs10. Referring to FIG. 5 , during a first time period, a plurality ofPCBs 10 having a first design are being produced, with first throughfourth selective adhesion blanks 12 and a first PCB 14 on the conveyormechanism 26. At this time, the computer 32 has already instructed,directed, or controlled the curing system 30 to be configured to curethe selective adhesion blanks 12 using the first design. The first andsecond selective adhesion blanks 12 are waiting to be cured. The thirdselective adhesion blank 12 is being cured. The fourth selectiveadhesion blank 12 has been cured and is waiting to have its flexiblefilm 16, curable adhesive 18, and bonded conductive layer 20 removed.The first PCB 14 has had its flexible film 16, curable adhesive 18, andbonded conductive layer 20 removed by the peel roller 28.

After the remaining selective adhesion blanks 12 have been processed,the computer 32 instructs, directs, or controls the curing system 30 tobe configured to cure the selective adhesion blanks 12 using the seconddesign. If the curing system 30 utilizes a laser source 38 to cure theselective adhesion blanks 12, then the laser source 38 is configured toguide the laser beam to follow the path to implement the second design.If the curing system 30 utilizes masks placed on the flexible film 16 tocure the selective adhesion blanks 12, then the computer 32 controls ordirects the placement mechanism 40 to position the appropriate mask overthe flexible film 16. If the curing system 30 prints masks onto theflexible film 16 to cure the selective adhesion blanks 12, then thecomputer 32 controls or directs the printing mechanism 42 to print theappropriate mask on the flexible film 16.

During a second time period, fifth through eighth selective adhesionblanks 12 and a second PCB 14 are on the conveyor mechanism 26. Thefifth and sixth selective adhesion blanks 12 are waiting to be cured.The seventh selective adhesion blank 12 is being cured. The eighthselective adhesion blank 12 has been cured and is waiting to have itsflexible film 16, curable adhesive 18, and bonded conductive layer 20removed. The second PCB 14 has had its flexible film 16, curableadhesive 18, and bonded conductive layer 20 removed by the peel roller28. After the remaining selective adhesion blanks 12 have beenprocessed, the computer 32 may instruct, direct, or control the curingsystem 30 to be configured to cure the selective adhesion blanks 12using additional designs, wherein each design may be utilized to cureand produce a variable number of PCBs 10.

Referring to FIG. 6 , a system 100 according to another embodiment ofthe current invention for providing dynamic feedback for selectiveadhesion printed circuit board (PCB) production is shown. The system 100includes a conveyor mechanism 126 with a belt 134 and first and secondrollers 136A, 136B, a peel roller 128, an optical inspection unit 129, acuring system 130 with a laser source 138, a placement mechanism 140, ora printing mechanism 142, and a computer 132 with a memory element 144and a processing element 146. The conveyor mechanism 126, the peelroller 128, the curing system 130, the computer 132, the memory element144, and the processing element 146 each are substantially similar instructure and function to the like-named components described above forthe system 10.

The optical inspection unit 129 generally provides visual inspection ofselective adhesion blanks 12 that have been prepopulated with parts orcomponents. The optical inspection unit 129 may include a camera or alens-based optical structure configured to provide a moving video imageand/or a sequence of periodically-captured still images. In variousembodiments, the optical inspection unit 129 may further include amemory element and a processing element, substantially similar instructure to the memory element 44 and the processing element 46,respectively, described above for the system 10.

The optical inspection unit 129 either captures moving video and/orperiodically-taken still images of the selective adhesion blanks 12 asthey are aligned with the camera of the optical inspection unit 129. Insome embodiments, the processing element of the optical inspection unit129 receives current image data from the video or still images andanalyzes the current image data of the upper surface of the flexiblefilm 16 with the preplaced parts. The optical inspection unit 129 hasstandard image data, stored in memory, of what the upper surface of theflexible film 16 including preplaced parts should look like. The opticalinspection unit 129 compares the current image data with the standardimage data. If no abnormalities are detected, then the system 100operates as normal. If the optical inspection unit 129 detects anabnormality, such as a pin on an integrated circuit (IC) through-hole orsurface mount package or a lead of a discrete component that ispositioned or oriented in a manner that is not present in the standardimage data, and is not a defect in the part, then the optical inspectionunit 129 may determine a modification to the design of the traces andpads for the PCB 14. Referring to FIG. 7 , for example, the opticalinspection unit 129 may modify the design by moving one or more padsand/or traces to allow the newly-positioned pin to be aligned with thepads to which it should connect. Referring to FIG. 8 , in addition, orinstead, the optical inspection unit 129 may modify the design by addingone or more parts, along with the appropriate pads and traces, toaccompany the changed part or to replace the changed part. The modifieddesign of the PCB 14 is transmitted to the computer 132. Alternatively,the modified design of the PCB 14 may be transmitted directly to thecuring system 130.

In other embodiments, the optical inspection unit 129 may transmit orcommunicate the current image data to the computer 132, and the computer132 may perform the analysis of the current image data of the selectiveadhesion blank 12. The processing element 146 may compare the currentimage data with standard image data retrieved from the memory element144. The processing element 146 may modify the design of the PCB 14, ifnecessary

The system 100 may operate as follows. Before operation begins, theoptical inspection unit 129 and/or the computer 132 are in possession ofstandard image data of what the upper surface of the flexible film 16including preplaced parts should look like for a particular design ofthe PCB 14. And, the curing system 130 is configured to cure the curableadhesive 18 of each selective adhesion blank 12 to implement theparticular design for the PCB 14.

A series of selective adhesion blanks 12 are fed or supplied to theconveyor mechanism 126. The selective adhesion blanks 12 move forward onthe conveyor mechanism 126 to the optical inspection unit 129. Thecomputer 132 may direct or control the operation of the conveyormechanism 126, such as setting the speed, and starting and stopping thebelt 134. The optical inspection unit 129 captures moving video or stillimages of each selective adhesion blank 12 as it comes into view. Theoptical inspection unit 129 generates current image data of the uppersurface of the flexible film 16 including the preplaced parts. Theoptical inspection unit 129 may include a memory element and aprocessing element which analyze the current image data, and/or theoptical inspection unit 129 may transmit the current image data to thecomputer 132. The processing element of either the optical inspectionunit 129 or the computer 132 compares the current image data withstandard image data of what the upper surface of the flexible film 16including preplaced parts should look like. If no abnormalities aredetected, then there is no change to the design for the PCB 14. If theprocessing element detects an abnormality or a difference between thecurrent image data and the standard image data, such as a pin on anintegrated circuit (IC) through-hole or surface mount package or a leadof a discrete component that is positioned or oriented in a manner thatis not present in the standard image data, and is not a defect in thepart, then the processing element may determine a modification to thedesign of the traces and pads for the PCB 14. Referring to FIG. 7 , forexample, the processing element may modify the design by moving one ormore pads and/or traces to allow the newly-positioned pin to be alignedwith the pads to which it should connect. Referring to FIG. 8 , inaddition, or instead, the processing element may modify the design byadding one or more parts, along with the appropriate pads and traces, toaccompany the changed part or to replace the changed part.

If there are no modifications to the design of the PCB 14, then thecuring system 130 cures the curable adhesive 18 on each selectiveadhesion blank 12, as described above for the system 10.

If there are modifications to the design of the PCB 14, then thecomputer 132 may transmit the modified design of the PCB 14 to thecuring system 130 and then direct the curing system 130 to cure thecurable adhesive 18 to form the pattern of traces and pads for themodified design of the PCB 14. In some embodiments, the curing system130 utilizes the laser source 138 and directs the laser beam to follow anew path to implement the modified design of the PCB 14. In otherembodiments, the curing system 130 generates one or more new masks toimplement the modified design of the PCB 14 and the placement mechanism140 places the new masks or the printing mechanism 142 prints the newmasks. The computer 132 may continue to direct the curing system 130 toutilize the modified design of the PCB 14 for each selective adhesionblank 12 which was detected to have the same difference in design.

Alternatively, the optical inspection unit 129 transmits the modifieddesign of the PCB 14 to the computer 132 which transmits it to thecuring system 130, or the optical inspection unit 129 transmits themodified design of the PCB 14 to the curing system 130 directly.

After being cured, the selective adhesion blanks 12 move forward on theconveyor mechanism 126 to the peel roller 128. The side wall of the peelroller 128 contacts the upper surface of the flexible film 16 andattaches to the flexible film 16. As the conveyor mechanism 126 movesthe selective adhesion blank 12 forward, the rotation of the peel roller128 pulls the flexible film 16 upward, removing the flexible film 16,the curable adhesive 18, and the bonded conductive layer 20. After theselective adhesion blank 12 moves past the peel roller 128, the flexiblefilm 16, the curable adhesive 18, and the bonded conductive layer 20 arecompletely removed, and the PCB 14 is ready to be further processed.

Additional Considerations

Throughout this specification, references to “one embodiment”, “anembodiment”, or “embodiments” mean that the feature or features beingreferred to are included in at least one embodiment of the technology.Separate references to “one embodiment”, “an embodiment”, or“embodiments” in this description do not necessarily refer to the sameembodiment and are also not mutually exclusive unless so stated and/orexcept as will be readily apparent to those skilled in the art from thedescription. For example, a feature, structure, act, etc. described inone embodiment may also be included in other embodiments, but is notnecessarily included. Thus, the current invention can include a varietyof combinations and/or integrations of the embodiments described herein.

Although the present application sets forth a detailed description ofnumerous different embodiments, it should be understood that the legalscope of the description is defined by the words of the claims set forthat the end of this patent and equivalents. The detailed description isto be construed as exemplary only and does not describe every possibleembodiment since describing every possible embodiment would beimpractical. Numerous alternative embodiments may be implemented, usingeither current technology or technology developed after the filing dateof this patent, which would still fall within the scope of the claims.

Throughout this specification, plural instances may implementcomponents, operations, or structures described as a single instance.Although individual operations of one or more methods are illustratedand described as separate operations, one or more of the individualoperations may be performed concurrently, and nothing requires that theoperations be performed in the order illustrated. Structures andfunctionality presented as separate components in example configurationsmay be implemented as a combined structure or component. Similarly,structures and functionality presented as a single component may beimplemented as separate components. These and other variations,modifications, additions, and improvements fall within the scope of thesubject matter herein.

Certain embodiments are described herein as including logic or a numberof routines, subroutines, applications, or instructions. These mayconstitute either software (e.g., code embodied on a machine-readablemedium or in a transmission signal) or hardware. In hardware, theroutines, etc., are tangible units capable of performing certainoperations and may be configured or arranged in a certain manner. Inexample embodiments, one or more computer systems (e.g., a standalone,client or server computer system) or one or more hardware modules of acomputer system (e.g., a processor or a group of processors) may beconfigured by software (e.g., an application or application portion) ascomputer hardware that operates to perform certain operations asdescribed herein.

In various embodiments, computer hardware, such as a processing element,may be implemented as special purpose or as general purpose. Forexample, the processing element may comprise dedicated circuitry orlogic that is permanently configured, such as an application-specificintegrated circuit (ASIC), or indefinitely configured, such as an FPGA,to perform certain operations. The processing element may also compriseprogrammable logic or circuitry (e.g., as encompassed within ageneral-purpose processor or other programmable processor) that istemporarily configured by software to perform certain operations. Itwill be appreciated that the decision to implement the processingelement as special purpose, in dedicated and permanently configuredcircuitry, or as general purpose (e.g., configured by software) may bedriven by cost and time considerations.

Accordingly, the term “processing element” or equivalents should beunderstood to encompass a tangible entity, be that an entity that isphysically constructed, permanently configured (e.g., hardwired), ortemporarily configured (e.g., programmed) to operate in a certain manneror to perform certain operations described herein. Consideringembodiments in which the processing element is temporarily configured(e.g., programmed), each of the processing elements need not beconfigured or instantiated at any one instance in time. For example,where the processing element comprises a general-purpose processorconfigured using software, the general-purpose processor may beconfigured as respective different processing elements at differenttimes. Software may accordingly configure the processing element toconstitute a particular hardware configuration at one instance of timeand to constitute a different hardware configuration at a differentinstance of time.

Computer hardware components, such as communication elements, memoryelements, processing elements, and the like, may provide information to,and receive information from, other computer hardware components.Accordingly, the described computer hardware components may be regardedas being communicatively coupled. Where multiple of such computerhardware components exist contemporaneously, communications may beachieved through signal transmission (e.g., over appropriate circuitsand buses) that connect the computer hardware components. In embodimentsin which multiple computer hardware components are configured orinstantiated at different times, communications between such computerhardware components may be achieved, for example, through the storageand retrieval of information in memory structures to which the multiplecomputer hardware components have access. For example, one computerhardware component may perform an operation and store the output of thatoperation in a memory device to which it is communicatively coupled. Afurther computer hardware component may then, at a later time, accessthe memory device to retrieve and process the stored output. Computerhardware components may also initiate communications with input oroutput devices, and may operate on a resource (e.g., a collection ofinformation).

The various operations of example methods described herein may beperformed, at least partially, by one or more processing elements thatare temporarily configured (e.g., by software) or permanently configuredto perform the relevant operations. Whether temporarily or permanentlyconfigured, such processing elements may constitute processingelement-implemented modules that operate to perform one or moreoperations or functions. The modules referred to herein may, in someexample embodiments, comprise processing element-implemented modules.

Similarly, the methods or routines described herein may be at leastpartially processing element-implemented. For example, at least some ofthe operations of a method may be performed by one or more processingelements or processing element-implemented hardware modules. Theperformance of certain of the operations may be distributed among theone or more processing elements, not only residing within a singlemachine, but deployed across a number of machines. In some exampleembodiments, the processing elements may be located in a single location(e.g., within a home environment, an office environment or as a serverfarm), while in other embodiments the processing elements may bedistributed across a number of locations.

Unless specifically stated otherwise, discussions herein using wordssuch as “processing,” “computing,” “calculating,” “determining,”“presenting,” “displaying,” or the like may refer to actions orprocesses of a machine (e.g., a computer with a processing element andother computer hardware components) that manipulates or transforms datarepresented as physical (e.g., electronic, magnetic, or optical)quantities within one or more memories (e.g., volatile memory,non-volatile memory, or a combination thereof), registers, or othermachine components that receive, store, transmit, or displayinformation.

As used herein, the terms “comprises,” “comprising,” “includes,”“including,” “has,” “having” or any other variation thereof, areintended to cover a non-exclusive inclusion. For example, a process,method, article, or apparatus that comprises a list of elements is notnecessarily limited to only those elements but may include otherelements not expressly listed or inherent to such process, method,article, or apparatus.

The patent claims at the end of this patent application are not intendedto be construed under 35 U.S.C. § 112(f) unless traditionalmeans-plus-function language is expressly recited, such as “means for”or “step for” language being explicitly recited in the claim(s).

Although the technology has been described with reference to theembodiments illustrated in the attached drawing figures, it is notedthat equivalents may be employed and substitutions made herein withoutdeparting from the scope of the technology as recited in the claims.

Having thus described various embodiments of the technology, what isclaimed as new and desired to be protected by Letters Patent includesthe following:
 1. A system for providing dynamic feedback for selectiveadhesion printed circuit board (PCB) production, the system comprising:a conveyor mechanism configured to convey a series of selective adhesionblanks, each selective adhesion blank being prepopulated with parts andutilized to produce a PCB, each selective adhesion blank including: aflexible film forming a top layer of the selective adhesion blank, asubstrate forming a bottom layer of the selective adhesion blank, aconductive layer formed from electrically conductive material andadhered to the substrate, and a curable adhesive positioned between theflexible film and the conductive layer, the curable adhesive configuredto selectively bond with the conductive layer when the curable adhesiveis cured; an optical inspection unit configured to generate currentimage data of each selective adhesion blank; a curing system configuredto cure the curable adhesive for each selective adhesion blank; and acomputer including a processing element in electronic communication witha memory element, the processing element configured or programmed to:receive a PCB design including placement of the parts and a pattern oftraces and pads, receive the current image data, compare the currentimage data with standard image data corresponding to the PCB design,determine a modification to the PCB design if a difference between thecurrent image data and the standard image data is detected, and directthe curing system to cure the curable adhesive of each selectiveadhesion blank for which the difference is detected according to themodification of the PCB design.
 2. The system of claim 1, wherein theprocessing element is further configured or programmed to direct thecuring system to cure the curable adhesive of each selective adhesionblank according to the PCB design if a difference between the currentimage data and the standard image data is not detected.
 3. The system ofclaim 1, wherein the modification to the PCB design includes arelocation of one or more traces.
 4. The system of claim 1, wherein themodification to the PCB design includes a relocation of one or morepads.
 5. The system of claim 1, further comprising a peel rollerconfigured to remove the flexible film, the curable adhesive, and thebonded conductive layer.
 6. The system of claim 1, wherein the curingsystem includes a laser source configured to generate a laser beam tostrike the curable adhesive in areas that create a negative of each PCBdesign.
 7. The system of claim 1, wherein the curing system includes aprinting mechanism configured to print a mask onto an upper surface ofthe flexible film.
 8. The system of claim 1, wherein the curing systemincludes a placement mechanism configured to place a mask onto an uppersurface of the flexible film.